
The ETS thermal shock chamber is a high quality design with an advanced touch screen controller and an innovative hot/cold transfer system. It is designed to meet strict Mil-Std test specifications, which require temperature recovery to be measured in the worst-case product sample.
ETS4-3CW Thermal Shock Chamber
The touch-screen controller is user-friendly and designed especially for thermal shock. For Mil-Std 883 testing, the controller actually speeds up test time by detecting when the product has achieved temperature and can go to the next step.
ESPEC’s electric screw-drive lift automatically moves the samples between hot and cold zones. This direct drive method eliminates the problems associated with cables, pneumatic cylinders, or other complicated mechanisms.
New: Compare Thermal Shock Models
Side-by-side comparison of up to three models.
| Model / Link | Interior Dimensions (W x D x H) |
Interior Volume | Temperature Range | Notes | ||
|---|---|---|---|---|---|---|
| ETS4-1CW | 20" x 20" x 16" | 4 cu. ft. | -75 to 200°C | Test example: -55 to 150°C in 15 min. worst-case on-product with 30 lbs. IC chips | ||
| ETS4-2CW | 20" x 20" x 16" | 4 cu. ft. | -75 to 200°C | Test example: -65 to 150°C in 15 min. worst-case on-product with 20 lbs. IC chips | ||
| ETS4-3CW | 20" x 20" x 16" | 4 cu. ft. | -75 to 200°C | Test example: -65 to 150°C in 15 min. worst-case on-product with 40 lbs. IC chips | ||
| ETS13-3CW | 28" x 33" x 24" | 13 cu. ft. | -75 to 200°C | Test example: -65 to 150°C in 15 min. worst-case on-product with 20 lbs. IC chips | ||
| ETS13-5CW | 28" x 33" x 24" | 13 cu. ft. | -75 to 200°C | Test example: -65 to 150°C in 15 min. worst-case on-product with 40 lbs. IC chips | ||
| Click model number for details, including metric & english units. | ||||||